Electronics Forum: 0402 and dimension (Page 5 of 21)

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Thu May 12 00:18:55 EDT 2016 | darby

Sorry for delay - been flat out. Sr - I understand what you are saying. My concern is that combined with the head offsets and variations in pick points (i.e. having to teach feeder positions for very slight amounts like 0.05mm)then you cycle times wi

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE

| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

0402's and Gluing.............

Electronics Forum | Wed Feb 16 16:41:31 EST 2005 | Mrduckmann2000

Pallets will not work in this case because the wonderful designers put 0402's between the legs and all around the legs of the thru-hole connectors. There are 18 thru-hole connectors on this board and 200 - 0402's around them. The 0603's that are al

Pad and Component Dimensions

Electronics Forum | Mon Jun 02 11:36:23 EDT 2003 | swagner

A good place to get the data you are interested in would be Philips CFT design guidlines.

Geometric Dimensioning and Tolerancing

Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon

GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C


0402 and dimension searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

Benchtop Fluid Dispenser
Selective soldering solutions with Jade soldering machine

Component Placement 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Best Reflow Oven