Electronics Forum: 0805 and pad and design (Page 5 of 9)

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach

| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm

SMT on rig-flex and multi-flex boards

Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron

Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da

Pick and Place vs CAD File

Electronics Forum | Fri Nov 24 22:32:12 EST 2017 | myke03o

Some Customers normally don't share CAD data in order not to copy the design. What you can do is use the Pick and Place file then plot to the pcb paste/silkscreen layer of the gerber using software. Not sure if your universal machine can load a gerb

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.

Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.

| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t

SMT Design: Package distance and stand-off height

Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl

For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 14:59:14 EDT 1999 | Chrys Shea

| Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these g

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t


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