Electronics Forum: 1

Registration to be Optional, To Earl, Steve, Scott, Bob, Brian, and All

Electronics Forum | Mon Apr 19 16:06:44 EDT 1999 | Cunli Jia

Dear Earl, Steve, Scott, Bob, Brian, and All, We want to thank you for starting or participating in the dialog and for your continued input, both technical and site related. Our vision at SMTnet is to create the most effective �One Click� communica

Re: Registration to be Optional, To Earl, Steve, Scott, Bob, Brian, and All

Electronics Forum | Tue Apr 20 04:04:14 EDT 1999 | Brian

Cunli Greatest news since sliced bread! Thanks. Brian | Dear Earl, Steve, Scott, Bob, Brian, and All, | | We want to thank you for starting or participating in the dialog and for your continued input, both technical and site related. | | Our vis

Registration to be Optional, To Earl, Steve, Scott, Bob, Brian, and All

Electronics Forum | Mon Apr 19 16:09:37 EDT 1999 | Cunli Jia

Dear Earl, Steve, Scott, Bob, Brian, and All, We want to thank you for starting or participating in the dialog and for your continued input, both technical and site related. Our vision at SMTnet is to create the most effective �One Click� communica

Re: Registration to be Optional, To Earl, Steve, Scott, Bob, Brian, and All

Electronics Forum | Tue Apr 20 03:42:41 EDT 1999 | Brian

Cunli Greatest news since sliced bread! Thank you. Brian | Dear Earl, Steve, Scott, Bob, Brian, and All, | | We want to thank you for starting or participating in the dialog and for your continued input, both technical and site related. | | Our

Singulation Machine - any suggested model types?

Electronics Forum | Thu Apr 11 05:47:21 EDT 2002 | ianchan

Hi everyone, Does anyone have experience and applications knowledge, to help recommend a singulation machine? for depanelization process of a : 1) 0.65mm thickness PCBA, with 0603/0402 SMD, 2) with materials composition makeup of a 1.5oz copper,

Heat Sink for QFP

Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef

Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio

Fudical, where, size, etc

Electronics Forum | Fri Nov 04 21:41:36 EST 2005 | mika

Have some mercy with my english. Russ is correct. We do simular things. The differents we do and this must be applied to who it concerns: We do ourself/or we often have requirements to the customer to layout the fid's to 1.5mm diameter. We have some

Flexible Circuit Board Finish ENIG or Hard Gold?

Electronics Forum | Wed Aug 24 16:30:11 EDT 2016 | shawn_halo_1

I have a 1oz Flex PCB (FPC) that has 2 0.4mm pitch connectors that need to be SMTd and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the FPC. The FPC has a one time bend radius of 15.5mm. Image is attached that show

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