Electronics Forum | Fri Oct 28 17:50:17 EDT 2016 | ttheis
Found a broken wire in the data line and I thought that was it for sure but was not. Checked continuity of the data cable and it is ok now but still no comm. The embedded controller status window shows "send failures" but no "reply failures." Winco
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Thu Apr 25 21:58:54 EDT 2002 | Gang shen
thank all of your kind help.today I set the camera gain and offset same as the camera2,the gain is 180,and the offset is 105. First the vision process is failed to pass ,later I found the size of the BGA ball in the screen is so smaller than the rea
Electronics Forum | Tue Jul 02 10:22:17 EDT 2002 | gwaco
Thanks brian, we do use "shape origin". Yet the connectors need constant tweaking. There is no slippage from the nozzle either. So what you are saying its possible that the designers may be using unicam center and we are using shape center? Is it pos
Electronics Forum | Tue Oct 01 16:33:33 EDT 2002 | slthomas
I know, I know. It's not a "solution", per se, because it's a bandaid for bad fabrication, packaging, and storage practices. Still, it's a reality with our overseas CM that has a plant in a very humid environment. Is 16 hours @ 105C the safe way to
Electronics Forum | Tue Oct 01 20:56:48 EDT 2002 | davef
Hey Steve, You shouldn't bake your boards, because it's a bandaid for bad fabrication, packaging, storage practices, and what not. You really should go back to the source of the problems and fix that so that you don't add non-value-added costs to
Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores
They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between
Electronics Forum | Tue Jun 14 13:41:56 EDT 2005 | greg
Hi all, I have a question to the users of the Topaz Xi machine. We currently are placing the electric capacitor (10.5 high) on the Topaz Xi (erlier we cut the nozzles 74). So the machine picks the component and placed. But there is small problem. Du
