Electronics Forum | Wed Aug 26 08:07:25 EDT 2009 | davef
Many solder wire suppliers put a on rolls of solder wire either a: * "Date of manufacture" stamp and then specify a shelf life in their product documentation ... OR * "Date of expiration." J-STD-005, 6.2, 6.3, and Table 4, where it states "If the st
Electronics Forum | Thu Sep 08 18:01:22 EDT 2011 | comatose
We had a camera die on one of our GSMs. I got a new camera, and it is working, but I need to either find a cal kit to rent for a day, or else if someone knows a reasonably accurate procedure to calibrate the new camera using the other upward looking
Electronics Forum | Mon Dec 22 16:20:03 EST 2014 | warwolf
Basically the contract comes first, then the design drawings then IPC. if your costumer is asking you to bend the PCB then it becomes apart of the design drawings. as for looking for a cover, get it in writing that that's what they want you to do. I
Electronics Forum | Fri Jan 16 16:57:14 EST 2015 | dilogic
I doubt you will be able to get satisfactory results with 0201. 0402 is another story. When doing 0402 projects, we use only electric (MP) feeders and always at the same feeder slots (feeder teach done for each of them). MPF08 nozzle works fine. Also
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Fri Sep 03 16:43:13 EDT 2021 | djenkins62
Hello Everyone, We are building devices to remove moisture from boards prior to rework where it does not require the use of ovens as stated in IPC-TM-650, Method 2.6.28. Instead of evaporation, we use moisture magnets to pull out the part......even
Electronics Forum | Fri Jun 09 17:45:05 EDT 2006 | mika
We have some problem with the Pb-free SOIC's at the UIC GSM2 on the Flexjet head camera; (seem to remember this from before, but I can't find it on this forum). The Pb-free small SOIC:s are reflecting the light differently than leaded parts and are
Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F
Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios
Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside
