Electronics Forum: 2.1 (Page 5 of 12)

Re: Wave Solder Dwell Time

Electronics Forum | Sat Nov 04 22:26:33 EST 2000 | Aoki Laboratories Ltd.

Greg, The operating parameters for Wave Soldering are: 1. Preheat Temp. (80-110 c, board surface); 2. 1.5-3 secs dwell time in solder. This, 1.5 second, is the time required for both the lead and solder to gain sufficient heat and as a result "tinn

BGA attach eval.

Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef

You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai

Noob needs a little help

Electronics Forum | Tue Nov 04 15:17:52 EST 2008 | iziris

This is my first circuit board that I am attempting to build and need a little help. Not exactly sure what is going on but maybe one of you guys could give some input. I am attaching the electrical diagram I am using. Everything thing seems to be wor

Don't understand the test results of an In-Circuit Tester

Electronics Forum | Wed Nov 16 03:41:43 EST 2016 | Haizen

I need to extract data from a log file and sort the data in an Excel file. Details are as follows: - Log File is a measurement result produced by an In-Circuit Tester (no info. about it, no name, no type, nothing). - Measurement Result is from

West coast testing labs?

Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef

Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M

Re: Wires UNDER BGA?

Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry

Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www

Profile

Electronics Forum | Thu Jan 10 06:52:51 EST 2002 | Dreamsniper

I'm using Kic Profiler and aluminium tape from Kic and thermocouples from Kic. They are good and reliable. I even manage to modify my heller 1088 by adjusting the fix conveyor and re-baffling the oven. Had dropped my 20-22 deg. C delta T down to 4.3

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

MSD Control

Electronics Forum | Thu Sep 22 06:54:14 EDT 2005 | Rob

Hi Gavin, Depends on what MSD class, but in general for the more sensitive parts if they've been opened & not used within the time limit it's rebake, add dessicant & seal. Our distribution side splits them down into more manageable/production size

Forums a bit ugly

Electronics Forum | Sun Sep 24 09:40:33 EDT 2006 | davef

Roland It's nice that Peter is considering improving the site. Things we'd like to see improved on SMTnet.com are: * SEARCH that works effectively. [We can't find postings that we've made. AND we know the key words. So, it must be painful for oth


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