Electronics Forum | Sun Aug 17 22:42:27 EDT 2014 | darby
Chapter 6 section 3-5 of the manual. If you don't have the manual send me your email and I'll send you the relevant section in pdf.
Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Wed Jan 22 07:05:11 EST 2020 | dontfeedphils
Just make sure they're in different parts of the bag before vacuum sealing. After the bag is sealed, neither will be going anywhere (unless your sealer isn't up to snuff and the bag leaks).
Electronics Forum | Wed Jan 22 08:23:49 EST 2020 | dgiordano
Thank You! We don't vacuum seal - we just heat seal. The standard doesn't require vacuum sealing, correct?
Electronics Forum | Wed Jan 22 08:25:27 EST 2020 | dontfeedphils
I don't believe it does, but don't quote me on that. Vacuum sealers can be had for pretty cheap.
Electronics Forum | Thu Jan 23 07:41:32 EST 2020 | stephendo
Too much vacuum can be very bad. It can create isolated pockets where the desiccant can not do anything. It can poke holes in the bag at corners. It can even pull moisture into the bag if too strong.
Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef
IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3
Electronics Forum | Fri May 07 22:22:22 EDT 2004 | Sam
Valuems, Thanks for your advise. Do your company have the vision software for the cognex 2000 Version 3.5 or 3.7 on hand for sale? The machine not any problems only can not boot up the vision system with the floppy disk which is damaged. Please give
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef
8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5
