Electronics Forum | Mon Feb 28 12:17:49 EST 2005 | lyrtech
TO JAY: What type of assemblies are you having 50-75% fill on. - Capacitor, resistor Are they single sided? - Yes Plated through hole? - No Is this a recent problem? - Yes, first time, but we don't know how long it last. TO RUSS: What is your t
Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef
Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr
Electronics Forum | Fri Nov 06 08:50:07 EST 2009 | jeffreyj
adlsmt - I do apply paste (Kester EP256) by hand to the boards now with 5 mil thick stainless steel stencils. A few of the parts almost always need rework, though, either because I didn't place them accurately or there's too much paste, or it got sme
Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd
I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
