Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike
| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
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