Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef
While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1
Electronics Forum | Tue Mar 19 17:08:12 EDT 2019 | asksmt
Hello Experts, is it acceptable in IPC standard to have two drill hole on a single pad overlapped? soldering and reliability wise ? intent is to solder two parts in parallel together. Thanks for your comments.
Electronics Forum | Fri Jun 30 15:34:09 EDT 2023 | calebcsmt
Doesn't IPC specify bridges are only unacceptable when uncommon, therefore if the leads were connected via trace wouldn't this classify them as common therefore acceptable? Would it be safe to say, at least from a electrical stand point its acceptab
Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1
Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I
Electronics Forum | Tue Sep 26 10:04:52 EDT 2000 | Chris May
Darren, You may/will get people referring you to the archives, which is a fair shout. But, by "failure rate" you probably mean "acceptance". What is good and bad depends upon your own acceptance criteria (IPC-610 ?). Find out what the acceptance c
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Sat Mar 25 07:43:20 EST 2006 | smartasp
Hi You all We use no clean flux in our lead free wave soldering process and have unacceptable residues. The provile is spot on. If I reduce the flux amount the holes won't be filled and border on the IPC II specs. The customer does not accept partia
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Sat Nov 25 21:26:55 EST 2006 | callckq
Dear all, I have an issue here where we found BGA crack. Understand from friend, we need to study any possiblity of our own jig or fixture cause this problem via strain gauge measurement..My question: Is there any standard @ specification establish
