Electronics Forum | Tue Feb 11 11:19:47 EST 2003 | dphilbrick
I agree with Dave, If you want to achieve S 20.20 you need the best. We were certified last year and due to the support we got from our vendor to guide us through what to do and not do as well as their ongoing training we passed first round.
Electronics Forum | Thu Apr 03 18:10:08 EST 2003 | Print Master
0402 Adhesive printing is possible with thicker stencils in order to allow mixed component technology. We have successfully printed 0402's with a 0.008" thick SS foil. Total material release is not achievable at this thickness, but not required u
Electronics Forum | Tue Sep 16 13:44:38 EDT 2003 | Duane
Below 40 microinches = Bad Solderability With pitches getting smaller and smaller flatness becomes more of an issue, but it's not to be achieved by blowing ALL solder off the pads.
Electronics Forum | Mon Sep 22 14:57:14 EDT 2003 | Guest
You're very vague in your description. Could you give a more detailed explanation about what you want to achieve ?
Electronics Forum | Wed Oct 15 16:15:24 EDT 2003 | russ
A good pad design along with a capable placement machine should handle this easily. 16mil pitch components need placement accuracy to about .002" so this shouldn't be a big problem to achieve. This placement tolerance is also basically the same as
Electronics Forum | Tue Dec 16 06:42:51 EST 2003 | Kev
I am having problems achieving correct pre-heater temperatures with our Hollis solder wave. Our original "Verification Golden board" program uses a conveyor speed of 5ft per minute and pre-heat temps of 300, 350, 400 respectively. Our "golden Board"
Electronics Forum | Mon Jan 26 05:45:51 EST 2004 | Sam
Does anyone know, what causes the orange peel affect when spraying pcbs with conformal coating ? Are there ways of minimising or eliminating this ? Is is possible to achieve a glass like finish ? if so how Thanks Sam
Electronics Forum | Thu Aug 26 12:06:53 EDT 2004 | loz
I think realistically any speed quoted by any manufacturer should be down graded to 80% of what they quote. This should be used as top end, then the component, feeder count and complexity will start digging into this. As for achieving 75% of book spe
Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng
It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.
Electronics Forum | Tue Jun 14 16:21:15 EDT 2005 | pr
My chipshooter will not "Time out", it will try to pick 3x and then alert the operator. Which would be 3 misses per empty reel. Unless I misread his post, he said 500 ppm at the placement machine. That makes a big difference.
