Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2014-07-23 17:19:28.0
IPC and Celestica announce that the IPC Pb-free Electronics Risk Management (PERM) Council is meeting in Toronto, Canada, July 22–24, to discuss lead-free conversion issues related to the safety, performance, reliability and affordability of electronics in the aerospace, defense, medical and other high-performance markets.
Industry News | 2016-01-05 13:48:52.0
Count On Tools is pleased to announce the company’s 25-year anniversary. In 1991, Curt Couch, President of Count On Tools, became a U.S. distributor of PB Swiss Tools, formerly known as PB Baumann Hand Tools. This business led to his further research in the surface mount technology and electronics manufacturing industry and, ultimately, the creation of Count On Tools Inc.
Industry News | 2019-09-25 16:22:29.0
Nordson ASYMTEK announces that it has celebrated 20 years of supplying fluid dispensing equipment to Demant A/S, a world-leading manufacturer of hearing aid brands that include Oticon, Bernafon, and Sonic. During this history, Nordson technologies have enabled Demant to design smaller and more capable hearing aids.
Industry News | 2022-09-26 06:55:04.0
The Women's Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will host presentations about technology innovations and career advancements from 1-3:15 p.m. CST on Tuesday, November 1, 2022.
Industry News | 2023-08-01 06:29:21.0
Smart home products have developed at an astonishing rate in the past few years, bringing convenience and comfort to family life. From small appliances to air conditioners, washing machines, refrigerators, and televisions, the popularity of smart home devices has become a trend in modern homes. However, in order to meet the growing market demand, the smart home manufacturing industry needs to constantly explore and innovate, and combine SMT (surface mount technology) production line equipment and THT (plug-in assembly technology) production line equipment to promote the further development of the industry.
Industry News | 2023-10-27 06:33:27.0
In today's fast-paced electronics manufacturing landscape, where efficiency and innovation are paramount, the Intelligent SMD Storage System (ISM2000) emerges as a groundbreaking solution under the esteemed I.C.T brand. This innovative system not only embodies European manufacturing excellence but also reflects I.C.T's forward-thinking approach to supply chain expansion by integrating European manufacturers. It harmoniously combines European craftsmanship with competitive Chinese pricing, delivering unparalleled cost-effectiveness.
Industry News | 2024-01-02 07:59:07.0
Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.
Industry News | 2024-03-19 07:59:17.0
Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications.
Industry News | 2024-03-26 13:55:04.0
Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
