Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian
| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath
Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon
| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like
Electronics Forum | Sat Oct 06 08:32:09 EDT 2001 | davef
Mr. Wizard is not currently available. You get the wizzer. Maybe your dream date will show later. Get your own lab tests done. Show your potential customer that your boards are clean. That�s the issue. The issue is not how you go about cleaning
Electronics Forum | Mon Jun 18 15:54:25 EDT 2001 | Gil Zweig
For BGA inspection, it is my feeling that he most effective technique a facility can use is the combination of a transmission x-ray system in conjunction with an endoscope (side viewing optical microscope). In using the transmission x-ray inspection
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Mon Sep 21 01:57:55 EDT 2009 | kaz
Hello All, My first visit here. I own and operate a small Industrial & Consumer Electronics Service Shop. There is more and more modules with high density fine pitch SMDs that we cannot handle. We bought PACE ThermoFlow BGA SMD station with a bunch o
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
Electronics Forum | Tue Jul 11 20:13:05 EDT 2006 | davef
We agree with Chunks. You need to turn-up the heat [slow the conveyor] because you have significantly changed the melting point of the solder alloy by adding so much gold. Relative to ENIG you should expect: * Similarly smooth surface, possibly a l
Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr
Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.
