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SMTA Announces AIMS Harsh Environments Symposium Call for Abstracts

Industry News | 2010-02-08 12:28:51.0

Minneapolis, MN - The SMTA and Auburn University are pleased to announce that the AIMS (Automotive, Industrial, Military and Space) Harsh Environment Electronics Symposium will be held October 25-26, 2010. Dr. John Evans, Conference Chairman and the program technical committee invite you to submit an abstract to participate in this exciting program. The symposium will once again focus on harsh environments with an emphasis on military and space.

Surface Mount Technology Association (SMTA)

2003 Designers Learning Symposiums Take Shape

Industry News | 2003-09-11 16:50:12.0

The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer

Association Connecting Electronics Industries (IPC)

SMTA International Conference on Soldering and Reliability Call For Papers

Industry News | 2008-12-15 16:20:40.0

Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.

Surface Mount Technology Association (SMTA)

SMTA International Conference on Soldering and Reliability Call for Papers

Industry News | 2010-01-17 22:24:09.0

Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

SMTA S.E. Asia Technical Conference Program Finalized

Industry News | 2014-02-11 18:21:25.0

SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 8-10, 2014 at the Eastin Hotel in Penang, Malaysia.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium

Industry News | 2024-03-18 11:59:32.0

The SMTA is excited to announce a Workforce Development Breakfast Panel, "Building Tomorrow's Expertise," taking place on March 26, 2024 in Peoria, Arizona, USA. The panel will be held at the Peoria Sports Complex, in conjunction with the SMTA Ultra High Density Interconnect Symposium.

Surface Mount Technology Association (SMTA)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Two Speakers

Industry News | 2008-09-12 03:52:21.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)


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