Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman
I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Wed May 10 13:21:58 EDT 2006 | scombs
Thanks for the reply. We have carefully inspected the part and solder joint after depaneling and all looks good. What is weird is if you remove the part from the board and check continuity with a meter you have a dead short. If you put on a new part
Electronics Forum | Wed Dec 27 20:33:50 EST 2006 | greg york
water alone especially cold is not good enough, how do you check for hasl fluids when most residues left behind after improper cleaning are non ionic. Use 40C saponifier followed by heated rinse then cold rinse then DI rinse followed by dry.Nylon bru
Electronics Forum | Tue Dec 02 18:10:39 EST 2008 | sys_steven
Need your opinion guys.. The old timers at the plant here feel that we should clean our board after Misprints withe the solvent cleaner over water wash. This is so they don't have to rebake the pcb for 24 hours before smt again. I don't believe th
Electronics Forum | Mon Mar 02 15:38:08 EST 2009 | kpm135
I would take the board in question and run it through again with your profiler to verify that no one has messed with your oven recipe, or your oven isn't malfunctioning. Also, a before and after pic attached to the post would probably be helpful to a
Electronics Forum | Thu Sep 20 03:31:42 EDT 2018 | minhhaioh34
Hi all, I need some pro help me with issue bubbles after coating. some information for some pro: Machine: Asymtek Chemical: Achime AVR80 Oven: IA 4 zoon4 ( setting 100 100 90 80 conveyor speed: 0.6 m/min). I had happened before and after the oven. W
Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis
Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen
Electronics Forum | Fri Jan 22 10:17:47 EST 1999 | LeeAnne
I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the coa
Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036
2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right
.gif)
