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MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Industry News | 2020-06-24 15:22:46.0

The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Releases CircuEtch 200 Anisotropic Final Etch for SAP and mSAP

Industry News | 2020-11-03 13:18:05.0

MacDermid Alpha Electronics Solutions announces the release of CircuEtch 200, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Latest Technology at Semicon Taiwan

Industry News | 2021-12-17 16:40:06.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for the emerging semiconductor market at the Semicon Taiwan, Taipei City, December 28-30, 2021 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

MacDermid Alpha Electronics Solutions

Effect of Alloy and Flux System on High Reliability Automotive Applications

Technical Library | 2017-01-05 16:55:11.0

The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.

MacDermid Alpha Electronics Solutions

Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements

Technical Library | 2017-07-13 16:16:27.0

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

Alpha Assembly Solutions

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions and Recycling Services at SMTA Michigan Expo & Tech Forum

Industry News | 2022-05-18 12:50:03.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.

MacDermid Alpha Electronics Solutions

MYDATA has qualified solder paste from Alpha and AIM for Jet Printing

Industry News | 2009-09-26 16:26:35.0

MYDATA announces that the two leading solder paste partners, Alpha and AIM, releases solder paste designed and qualified for the MYDATA MY500 Jet Printer.

Mycronic Technologies AB

MacDermid Alpha to Promote New ALPHA® Argomax® AccuLam™ Sintering Film and Package Attach Sintering Application at PCIM Europe

Industry News | 2022-05-05 17:43:39.0

MacDermid Alpha Electronics Solutions will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

MacDermid Alpha Electronics Solutions

Ersa to introduce IoT Soldering Station, Additive Manufacturing and Selective Soldering Machines at APEX 2022

Industry News | 2022-01-03 07:27:32.0

Kurtz Ersa Inc. today announced plans to participate in the 2022 IPC APEX EXPO, scheduled to take place January 25-27, 2022 at the San Diego Convention Center in California. Ersa will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, hand soldering, additive manufacturing, I4.0 connectivity and more. The company will highlight Ersa's new i-CON TRACE Soldering Station, Alpha 140 - 3D Metal Printer and VERSAFLOW ONE Selective Soldering System during the event.

kurtz ersa Corporation

Heraeus Electronics, MacDermid Alpha Electronics Solutions and Henkel Win Patent Infringement Lawsuit Against Senju Group

Industry News | 2024-04-08 14:13:51.0

Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju's infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

Heraeus


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