Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Wed Jun 29 12:04:29 EDT 2022 | kumarb
Hi. Alpha metals recently informed us of: Alpha OM-565 low temp solder which they note is popular with pin-in-paste process of through hole parts so that we can solder inside of our SMT oven (1809EXL). We commonly use ROHS DSUB connectors (9 to 78
Electronics Forum | Mon Nov 20 16:56:19 EST 2006 | russ
Ahh the old Kester dry product EM907 just had major thicjener issues, we wer quailifying the kester product and could not get out of tube. needless to say it failed the qual. I was informed by Kester rep that all lots were recalled for this? was y
Electronics Forum | Mon Aug 13 12:38:38 EDT 2012 | grahamcooper22
Maybe the area ratio between the sides of the stencil apertures and the aperture opening is too low for the spec of the paste ? So it will tend to stick in the apertures. ...only solution is thinner stencil or a paste that can release easily when are
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Electronics Forum | Fri Apr 13 17:11:12 EDT 2007 | jmelson
Even though this is a "no clean" flux, are you (or the customer) cleaning the boards? If this is truly a low signal level device, there is no way you will get away without cleaning the flux residue. I do a lot of low-level hardware, and we have to
Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr
Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem
Electronics Forum | Mon Oct 20 11:44:41 EDT 2008 | jdumont
Good morning all, we have been having some random intermittent connections on some BGAs lately on ENIG finished boards. Can you take a quick look at this picture (link) and let me know if it looks like a possible black pad occurrence? The picture sh
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
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