Electronics Forum | Mon Dec 05 09:22:35 EST 2005 | BReiman
Does anyone know of any resources that will come into our company and provide a gap analysis between the RoHS requirements and our current processes and proceedures? We have done a lot of work so far but we want to make sure there isn't something we
Electronics Forum | Wed Jun 15 23:12:43 EDT 2022 | glasscake
New to X-Ray inspection, looking for documentation on finding, analyzing, determining, ext defects with a 2D 5 axis machine
Electronics Forum | Thu Jun 16 03:11:44 EDT 2022 | leaderway0
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Electronics Forum | Tue Sep 11 21:47:24 EDT 2001 | arul2000
Hello, I am looking for information on the Dye Penetration test for area array package failure analysis. Any recommendation on the dye to use? Any articles leading to this? Any comments on the effectiveness of this test? Regards, Arul
Electronics Forum | Wed Sep 12 20:41:24 EDT 2001 | arul2000
Thanks David.I do not have any specific failure analysis to do now. But, like to use this technique in future. Appreciate your composure even during this time of unprecedented attacks. Regards, Arul
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Wed Sep 12 21:13:17 EDT 2001 | davef
Just because I�m not currently ranting about nuking Kabul, Tehran, Baghdad, and Algiers or laying a coat of jellied gasoline on those little punks celebrating with their candy in Palistine; that doesn�t mean my shock and grief will not turn to anger.
Electronics Forum | Mon Jul 30 20:38:02 EDT 2012 | davef
I'm with you on microcracking. The best way to confirm this is through sectioning of the affected capacitors. You're fortunate to be seeing these failures showing-up early in your product life. Of times these failures don't appear for years.
Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway
I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.
