New Equipment | Cleaning Equipment
Aqueous / Semi-Aqueous Inline PCB Cleaning Systems Durable Construction The HydroJet™ in-line system is constructed of high-density polypropylene for excellent chemical compatibility and long life. It has a non-corroding rigid metal chassis, unib
New Equipment | Assembly Services
Lead and RoHS (Lead-Free) operations CAMtek specializes in electronics assembly of high-mix, low to medium volume builds of circuit cards and electro-mechanical assemblies. With 92,000 sq ft CAMtek’s state-of-the-art manufacturing facility offers a
New Equipment | Cleaning Equipment
PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
New Equipment | Cleaning Agents
AQUANOX A4382 is a near-neutral range pH chemistry designed with superior cleaning efficacy with great material compatibility on surface mount assemblies. A4382 most effectively cleans organic acid flux residues at lower concentrations. AQUANOX A4382
New Equipment | Cleaning Agents
KYZEN E5631 is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil, and ultrasonic systems. E5631 was formulated with the worker and environment in mind and is a cost-ef
New Equipment | Cleaning Agents
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in surface mount printing processes. A8820D removes all un-reflowed solder paste using spray-in-air and s
New Equipment | Cleaning Agents
KYZEN E5615 is an aqueous-based cleaner designed to be the fastest drying chemistry in the industry. E5615 is engineered to reduce stencil underwipe coefficient of variation and improve solder paste release. KYZEN E5615 is shipped ready to use and su
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
