Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
Electronics Forum | Wed Jul 23 08:18:29 EDT 2008 | davef
Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special pl
Electronics Forum | Fri Feb 19 16:45:55 EST 1999 | Steve Gregory
Hello Ryan! There's a company called Camalot that sells dispensers that in my opinion, make one of the better dispensers on the market. They use what's called a rotary-positive displacement pump when dispensing... much more precise and accurate
Electronics Forum | Wed Jul 14 19:15:59 EDT 1999 | JohnW
| Can plcc's be glue on the a board if not why? | Ron, The biggest problem you have with PLCC's is the hieght of the base of the component from the board, if you can get a glue dot high enough then yes you could do it. Probably the best method is d
Electronics Forum | Wed Mar 02 09:06:44 EST 2005 | russ
We use 10% reductions when either the aspect or area ratio will not be affected. We will utilize a 1:1 when necessary. We place a lot of those little Rnets down to 0805 size .5mm pitch and do not see any problems. We use 6 mil stencils almost excl
Electronics Forum | Fri May 14 12:13:35 EDT 1999 | Heather
| Hi Guys, | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | So, any of you folks who have already experi
Electronics Forum | Mon Aug 30 11:20:12 EDT 1999 | John Thorup
| | | Planning to evaluate the above process... | | | Can anyone can give me some tips/infos on the above.... | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile diff
Electronics Forum | Mon Aug 30 12:02:16 EDT 1999 | Brian Wycoff
| | | | Planning to evaluate the above process... | | | | Can anyone can give me some tips/infos on the above.... | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profil
Electronics Forum | Tue Aug 31 03:37:19 EDT 1999 | Wolfgang Busko
| | | | | Planning to evaluate the above process... | | | | | Can anyone can give me some tips/infos on the above.... | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
