Electronics Forum | Thu Dec 15 19:29:38 EST 2016 | joongjoo
How could you shorten model change time (Pb Pb Free products) when using with same Reflow? By the way, we are producing automotive parts
Electronics Forum | Thu Feb 09 04:28:05 EST 2017 | soldertraining
Solder Pastes are used particularly in the assembly of printed circuit boards (PCBs) for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, net
Electronics Forum | Tue Mar 14 14:13:14 EDT 2017 | cyber_wolf
I don't have an answer but I am curious. What data/testing shows that this voiding is detrimental? How did the auto industry arrive at
Electronics Forum | Tue Mar 14 14:15:03 EDT 2017 | dontfeedphils
I've always been happy with ~25% or less combined voiding on QFN ground pads (depending on the pad dimensions).
Electronics Forum | Wed Mar 15 10:12:22 EDT 2017 | pzappella
Hello, A speaker at the conference is where I heard that the auto industry wants
Electronics Forum | Wed Mar 15 11:43:45 EDT 2017 | rob
Hi PZ, What, sort of like this one? http://creativeelectron.com/papers/EconomicsofLEDVoiding.pdf It even has the handy calculation for the reduction in thermal performance with voiding.
Electronics Forum | Wed Mar 15 11:51:35 EDT 2017 | cyber_wolf
Rob, I believe that is for die attach voiding not solder interface.
Electronics Forum | Wed Mar 15 12:05:24 EDT 2017 | emeto
Rob, Absolutely agree. Customer precedes standard. As you mentioned design engineers, I think that PCB design has the biggest influence on the voiding. Everything else we do is trying to fix bad PCB design.
Electronics Forum | Wed May 31 07:55:55 EDT 2017 | buckcho
In IPC it is said that the void % should be established between you and the customer. There is no number. There is only requirement for balls on BGA. I have a customer that agreed to 40% on D-packs which is okay for both us and them.
Electronics Forum | Sat Apr 28 08:04:29 EDT 2018 | shuhaib
Hi, please go through IPC 7093, its only for design and assembly process implementation for bottom termination components. its says up to 50% voids will not reduce ant electrical and thermal performance.
