Electronics Forum | Tue Mar 21 17:32:48 EST 2000 | Charles Barker
Greetings all you knowledgable SMT persons! 1. Typically, for multi-layer (6-8 layers), FR4, SMT boards stored in an air conditioned environment at about 50+/- 10% RH, how many months (or years) would you allow to pass before you would recommend bak
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
Electronics Forum | Tue Jun 06 05:26:04 EDT 2000 | Jacqueline Coia
Hi There, Could someone please point me in the right direction in the subject of baking 'metal' packaged BGAs before rework. What are recommended baking temp. & time. Much appreciated. Jack
Electronics Forum | Thu Oct 26 12:27:40 EDT 2000 | Dave Cunningham
What guidelines would you suggest for an assembly house concerning the baking of bare PCB's (assume FR4) and flexes/rigid-flexes before assembly.
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Mon Jan 30 11:57:06 EST 2006 | james
We are running under 5% RH. The parts we are having problems with are QFP 208. We have a clean process and right now I am baking 3 boards before they remove the parts and then sending them back to test.
Electronics Forum | Mon Mar 05 10:30:28 EST 2007 | Rob
We've got away with 90C before, however at 120C they tend to bananna and it isn't easy to remove all of the product then, and some of the legs get damaged (we always received waffle packs then one day tubes arrived & the operator baked as usual....).
Electronics Forum | Wed Apr 04 17:40:39 EDT 2007 | davef
Rob: How do you rework blow-holes and pin-holes? PTH plating thickness SB 1 thou or greater. Epoxy is hydroscopic. So, you should control the environment and/or bake the moisture from the boards before soldering. Search the fine SMTnet Archives f
Electronics Forum | Wed Jun 18 11:34:23 EDT 2008 | slthomas
"And we have evaluated this process before 2001." How did you quantify the level of moisture left in the components after the bake?