Electronics Forum: banding (Page 5 of 13)

TOMBSTONE DEFECTS

Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas

I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to

BGA inspection scope - Visual

Electronics Forum | Thu Jun 19 16:58:11 EDT 2003 | blundell

We can speak from experience, the Ersascope needs only 1.5mm to see along side a device and is the only system that looks low enough, the cheaper systems may be fine for normal packages but forget it for csp's, micro BGA's Also its the only system th

Dek 249 loosing print speed setting after a few passes

Electronics Forum | Thu Jul 21 22:22:50 EDT 2005 | Ken

Hey, Peter. back in the mid 90's I reversed engineered their drive system because of a dispute over print speed malfunctions. I prooved correct that they had made published claims about their drive topology that were not true. They agreed to redes

Solder Wave

Electronics Forum | Thu Aug 11 08:56:20 EDT 2005 | pjc

Some causes of lack of top side fillets (hole fill) are: 1. Not enough pre-heat (a top side preheat will help, if no-clean flux, be sure to follow flux mfrs specification for top side board temp just before hitting wave) 2. Not enough flux 3. Flux i

Pb-free wave soldering with SMD

Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc

I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At

Fuji CP4&CP6 Placement issues

Electronics Forum | Tue Feb 07 11:41:36 EST 2006 | PWH

Band Aide Quick Fix to get you running - Change x-value for all global fiducials in your program the exact same amount as the x-offset you are experiencing on your bad machine. Likely, if (0,0) is front-left, you should move all global fids 0.3mm th

Internal Oven Calibration

Electronics Forum | Sat Feb 11 18:33:36 EST 2006 | KEN

One factor everyone overlooks is that furnace and external T/C wires are (generally) not calibrated. Unless you are sending your wires to a lab for NIST characterization your T/C wires are NOT calibrated. They (new wires)operate within a specifie

Fluxer Traverse Speed

Electronics Forum | Wed Sep 30 13:13:16 EDT 2009 | mikesewell

I never calculate it when I setup a profile...I have a feel for our fluxer setting and adjust based on belt speed and width. I also have different nozzles and a pressure setting to play with. Inspect the bottom of the board for good coverage. Runn

reflow oven advice

Electronics Forum | Fri Mar 15 15:34:37 EDT 2013 | anvil1021

In my experience used reflow ovens have been problematic. There are lots of adequate or better reflow systems out there that wont break the bank too badly....the N2 question, if you are going to be using solder that requires higher reflow temp than d

Solder pot & wire tinning help

Electronics Forum | Mon Mar 02 11:15:23 EST 2020 | slthomas

You'll want to chop your solder into "bite sized" pieces for your pot, by the way. A bolt cutter or a band saw are a couple of ways to do it without ruining other precision tools. It's up to you for the alloy you use, but there are several (some


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