Electronics Forum: bga balls (Page 5 of 141)

Losing balls on BGA's after second side reflow

Electronics Forum | Fri Jun 25 07:33:23 EDT 2010 | CL

Good Morning JM, Does anything come into physical contact with the BGA in question during the reflow event? Is this a RoHS process? If so, is the BGA in question also a RoHS part? Thanks Chris

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ

Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p

Re: BGA-Problems with adhesion of the solder balls

Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen

Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip

Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Thu Oct 05 16:03:31 EDT 2006 | C.K. the Flip

I had horrible experiences with a certain brand on multiple types of BGA's (I choose not to mention the brand). The paste was nice and active, but almost to a fault when it came to BGA's. Finally, I arrived at a profile with a more agressive ramp u

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 14:48:49 EDT 2006 | cw

My soak at 150C - 180C for approx. 85sec to 100sec. I believe this is sufficient. I can't change my paste because customer wants to use SnPb paste with SAC solder balls. They claimed that they have sucessful result with other CM. I need to know if

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG

We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p

Missing BGA Balls

Electronics Forum | Mon Jul 10 12:07:20 EDT 2006 | CKH

Hi Folk, if i have already mounted a BGA ICs with Missing BGA Balls onto the board, what will the Missing BGA Balls look like in X-Ray (2D & 3D).... A Big Void or will it look the same as other BGA Balls? Appreciate your advice. Thks & Rdgs CKH

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:19:07 EST 2004 | Evtimov

Hi Bryan The answer is in the paste compozition. Balls of the BGA are usually made by eutetic solder paste.

Missing BGA Balls

Electronics Forum | Fri Jul 21 08:30:32 EDT 2006 | CKH

Thks for the advice....


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