Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Tue Aug 26 14:13:46 EDT 2003 | robd
We have seen "coplanar problems" on BGAs supplied by some suppliers. We have seen large enough spere variation to cause opens with our standard .006" paste process (paste and profile work fine "most" of the time) . Although not an extremely technic
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Mon Feb 25 08:14:04 EST 2008 | adetuc
Hi ... We use DRS24C Air-Vac machines for placing BGA devices, and have been having problems with shorts on corners of one device in particular, its a PBGA and its size is 4.5cm square and 15grams weight. When the component is picked up and the com
Electronics Forum | Tue Oct 19 15:16:38 EDT 1999 | Frank Stryker
The CCGA is like a BGA except that the columns are more square looking and there are many more of them. They are made of lead so they are very fragile. They are very expensive. There is a special cleaning process they have to go through once it has b
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
Electronics Forum | Mon Aug 24 18:34:31 EDT 1998 | Steve Evers
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G If your new to the world of Fying Probe ICT you may think this is a new developement. Its not, this technology has been around for 10+ years. M
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
