Electronics Forum | Tue Nov 20 12:25:52 EST 2007 | realchunks
It can be done. But as Rob states, use edge rail oven. We have a product 18 inches long by 9 inches wide with BGAs on both sides.
Electronics Forum | Wed Jul 08 15:18:20 EDT 1998 | Upinder Singh
We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the parame
Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas
We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe
Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Fri Jun 19 15:03:15 EDT 2020 | jmelson
OK, I am really happy with the robustness of my CSM84. I wonder how hard it would be to hack up one of these 3-phase machines to run off single-phase power? Mostly, it just feeds a big DC supply for the X-Y servos. 2 heads with ANE should be just FI
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert
OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun
Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL
vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c
Electronics Forum | Wed Nov 12 06:23:09 EST 2008 | griffin
One thing to consider regarding the capacitor, The leads are not 100% straight beneath the plastic bottom part. And if you align with regards to the two leads, the leads will be aligned to the pads of your board, but the body of the capacitor is look
Electronics Forum | Sat Mar 14 09:12:59 EDT 2009 | davef
First, there is no good justification for getting solder on gold fingers. Second, it is well known that solder on gold fingers is unacceptable. So, shipping boards with that condition indicates sloppy quality practices at your CM. Third, that being
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