Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd
Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door
Electronics Forum | Tue Jun 13 04:46:15 EDT 2006 | AR
Has anybody else noticed a problem with Assembl�on's mechanical 12 mm feeders, with 4 mm pitch? We are experiencing grave pickup problems with a MELF diode packed this way and fed with this type of feeder. If I attach a hefty weight to the blister ta
Electronics Forum | Wed Feb 09 07:04:08 EST 2000 | Jacqueline Coia
Could anyone please tell me the recommended guidelines regarding the max. time and the storage environment for complete (plastic blister tape) SMD reeled components before being used. This is before any associated quality problems occur during assemb
Electronics Forum | Tue Aug 14 17:09:37 EDT 2001 | davef
Dano's confused. The boards are delaminating during soldering. The delamination just isn't immediately appartent after soldering. Stepping backwards. It's remotely possible that if the boards were blistering hot from soldering and then dumped in
Electronics Forum | Thu Jul 03 08:40:23 EDT 2003 | Kris
Hi, undercured solder resists may be a defect people have seen so far. Some of the probles arising is blistering as well as reaction with wave solder flux that may lead to some kind bad gel like formations. Gels the idea would be to reflow the ba
Electronics Forum | Tue Aug 23 13:10:29 EDT 2005 | davef
We've never heard of this [but all of our gold is electroless, not electrolytic]. If the delamination is caused by the electroylic gold finishing and the via plug process during fabrication, something is wrong. Either your supplier: * Is goofy ...
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev
Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001
Electronics Forum | Fri Jul 28 09:20:10 EDT 2006 | pavel_murtishev
Good afternoon, No, defects aren�t trace related. I�ve just posted reflow profile (reply to Chunks). I suspect the component only. All other components are fine. But I can�t understand what exactly happens with this component. I tried to play with s
Electronics Forum | Fri Jul 28 11:01:45 EDT 2006 | rlackey
No, you can easily find out if it's a part issue - put down another component with the same footprint(either a chip cap or a different value resistor - like the one in the picture)on the pads where you are having problems and relow as normal. If it
