Electronics Forum: board density (Page 5 of 16)

reflow profile

Electronics Forum | Tue Feb 19 10:50:13 EST 2019 | rgduval

Call Heller directly, and give them the oven, and relative thermal density of the board, as well as the solder paste that you're using. They'll be able to give you a baseline profile to start from (both RTS and RSS). Otherwise, use a thermocouple p

Starting point 7 zone oven profile for lead free - 2 layer simple board, but high mass electrolytics

Electronics Forum | Wed Apr 23 09:38:05 EDT 2014 | rgduval

Get in touch with your paste manufacturer. They should have a data base of different oven types/zones, and can give you "baseline" settings for a medium thermal density board that has been proven to work well with their paste. After that, it sounds

Reflow Oven Recipes

Electronics Forum | Wed Jul 02 18:01:14 EDT 2003 | csimfgeng

We provide each assembly its own recipe then customize the unique recipe as required, using a SlimKIC 2000 profiler. This tool allows precise control of the reflow process and accounts for the component and layer densities of each board. This appro

Re: high temperature solder alloy

Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang

| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther

Are US OEM Manufacturers Dead?

Electronics Forum | Sun Jun 02 23:20:39 EDT 2002 | fastek

China is way behind the technology curve and will be for some time. They're still soaking up all of the through hole and 10 year old chipshooters they can get their hands on. China is the latest flavor of the month for cheap labor just like Mexico wa

Re: high temperature solder alloy

Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson

| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi

ERSA Hotflow5

Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo

Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d

Low volume oven recommendations

Electronics Forum | Thu Feb 10 19:54:28 EST 2011 | kahrpr

You answered your own question you get what you pay for. $3500 dollar’s for a small oven is not unreasonable. I have seen small proto type ovens do a pretty good job on basic circuits. If you are getting into high density BGa stuff and multi layered

Re: BGA PAD REDUCTION

Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn

| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going

changing from no-clean to clean

Electronics Forum | Wed May 22 08:43:40 EDT 2002 | pjc

I have experience cleaning NC for military boards. The reason for cleaning the NC is due to conformal coating requirements. Zestron Vigon A200 and Atron AC 100, as well as Petroferm Hydrex DX have both been effective at cleaning Alpha UP78 NC paste.


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