Electronics Forum | Sat Apr 30 00:28:46 EDT 2005 | thaqalain
I failed in a Soldering interview.My recruiter send me for PTH wave soldering. The company given me a small board and asked me to take out rectangular prismatic shape PTH components,I tried to put two guns around solder bonds one by one alongwith flu
Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424
I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of
Electronics Forum | Wed Oct 15 09:53:01 EDT 2003 | markhoch
These boards also were above liquidus for 75 seconds, and the customer puts the boards thru extensive thermal shock and stress testing. An Alpha Applications engineer told me that because the boards were above 183 degrees for 65-75 seconds that the i
Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid
Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre
Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22
Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Wed Feb 10 01:53:04 EST 2010 | sparrow
Hello Glenn, thanks a lot for your response. The company I work for is launching LEDs production this year. We'll need to do a number of the environmental tests in our quality control laboratory. So the application for SAM and Xray systems is inspect
Electronics Forum | Sat Oct 15 01:47:09 EDT 2022 | auriga2001
I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it rea
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