Full Site - : bondability of gold (Page 5 of 18)

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

Industry News | 2013-05-13 15:06:06.0

AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.

AIM Solder

Microtronic to Display Range of Products at SMT/Hyrbid/Packaging 2015

Industry News | 2015-04-07 15:34:16.0

Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Microtronic GmbH

Viscom presents advantages of 3D bond inspection at electronica

Industry News | 2018-11-14 15:31:00.0

With a wide range of inspection systems and camera modules, Viscom AG is offering outstanding solutions for fast, high-precision wire bond production inspections. At the electronica trade show in Munich from November 13-16, visitors can experience firsthand what 3D measurement contributes to product quality in this field.

Viscom AG

Scienscope Hits 30 Years of Innovation in Electronics Inspection Solutions

Industry News | 2024-01-15 13:53:57.0

Scienscope International is proud to announce its 30th anniversary. For three remarkable decades, Scienscope has been at the forefront of the field, driving innovation, and setting the standard for inspection technologies.

SCIENSCOPE International

wave soldering has become the future direction of development

Industry News | 2018-10-18 09:33:23.0

wave soldering has become the future direction of development

Flason Electronic Co.,limited

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Industry News | 2010-02-19 09:45:37.0

Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding

Sensor Products Inc.

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals

Technical Library | 2015-03-26 19:16:03.0

Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.

University of Maryland

Brief description of ENIG for Multilayer PCB

Technical Library | 2013-01-18 02:42:14.0

ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...

Everest PCB equipment Co.,Ltd

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

MARCH Products | Nordson Electronics Solutions


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