Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Thu Dec 17 18:08:41 EST 2009 | lynn_norman
Back in a former life, we had 3 products that were PCBs bonded to aluminum boards. We used a PSA from 3M to bond the board to the aluminum. Polymers are almost invisible in x-ray, but ultrasound worked quite well. You should try CSAM. Don't know
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Mon Mar 17 10:36:04 EST 2003 | davef
Ramanandkini 14 gm versus 5 gm: 14 gm [even 10 gm] sounds better than 5 gm. We get good bond pull XBAR (high teens) and low sigma (
Electronics Forum | Mon Aug 02 11:44:49 EDT 2004 | jbabson1
If you do wire bond before printing, Photo Stencil (www.photostencil.com)can help you design a stencil with relief on the pwb side for the wirebonding.
Electronics Forum | Tue Feb 08 11:14:45 EST 2005 | George
Have a customer that needs to find someone that can do Chip on board Wire bonding automated only. You folks know of anyone? We are in the Newengland Area. You know, where the Patriots reside?
Electronics Forum | Sun Sep 04 23:42:31 EDT 2005 | juan2208
hi all, i have a question about the wirebonding That is under what circumstances that the ball bonding is used and under what circumstaces the wedge bonding is used? thanx advanced.
Electronics Forum | Thu Dec 15 16:12:56 EST 2005 | davef
Liza Could increases in adhesion due to exposure to high temperature and humidity in storage environments be an explantion to this cover tape excessive bonding issue? We agree with GS that heat bonding is so 1970s. Most heat bonders can fairly eas
Electronics Forum | Tue Dec 27 10:00:19 EST 2005 | sparrow
Hello, does anybody have experience in thermosonic gold wire bonding to electroless nickel/immersion gold?? regards, Sergey
