Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Mon Jun 26 21:56:48 EDT 2000 | Dave F
Christopher: Hope the link below helps. Dave F
Electronics Forum | Thu Aug 23 20:56:08 EDT 2001 | davef
Print paste on tempered glass, place the parts, and reflow. What's the story?
Electronics Forum | Thu Jun 09 12:46:03 EDT 2016 | wlsmt
Tks DeanM
Electronics Forum | Fri Jun 17 14:55:01 EDT 2016 | wlsmt
Tks Laynefelix
Electronics Forum | Wed Mar 31 18:59:50 EST 1999 | Ron Beasley
Has anyone heard of a problem with catastrophic failure of large value (200uF) solid tantulum capacitors that have been exsposed to high humdity.
Electronics Forum | Wed Nov 29 17:00:40 EST 2006 | John S.
We've used both effectively to resolve this issue. Check with your stencil manufacturer. Often, they can give you a very good starting place on issues like this since they see everyone's designs. John S.
Electronics Forum | Wed Nov 29 17:05:15 EST 2006 | slthomas
I have used a 10% area reduction with home plates on 6 mil stencils with good success. If you're using 5 mil stencils you might go with 0 or 5% reduction.
Electronics Forum | Wed Nov 29 22:48:42 EST 2006 | davef
Look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=45733
Electronics Forum | Fri Dec 15 00:11:12 EST 2006 | pnguyvu
Contact Steve Yen @714-636-6211 or incoming@usastencils.com He'll be happy to help to with that. Good luck !
