Electronics Forum | Tue Jun 28 00:11:30 EDT 2016 | ricoloverde
Hi, new to the forum here. First Post! Ive been using a Samsung sm482 for about 2 years and recently got the heads up that we will be getting a project soon with a BGA chip. Im wondering if anyone on here uses the SM482 for BGA and if so, can offer
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman
Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (
Electronics Forum | Sat Oct 10 08:12:50 EDT 1998 | Rick I.
we currently have a siplace line(80s/f) and are inhereting a fuji line from another site. I need an objective comparison between the two. What are the strengths and weaknesses of the fuji with regard to programming, operating and maintenance. any cav
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Thu Sep 07 15:24:29 EDT 2000 | Murad Kurwa
Steven, Try http://www.document-center.com/home. You will find various standards for BGAs freely-available but not for free. BTW, I have never seen a BGA underfilled. Only FC and CSPs. The standards available will explain when to.....High CTE delta
