Electronics Forum: class 3 (Page 5 of 37)

Re: IPC610 spec's.....Am I the only confused one???

Electronics Forum | Wed Feb 24 10:56:12 EST 1999 | Steve Schrader

| Under IPC-A-610 Section 10.3(Components on their sides) it reads: | ______________________________________________________ | Acceptable - Class 1,2 | Nonconforming Defect � Class 3 | | Chip components on its side provided the following | are

When does SMT inspection/touch-up become rework?

Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson

You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented

Accidental solder mask

Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ

You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

defects in pcb manufacturing

Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar

Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr

Inline Washers

Electronics Forum | Mon Mar 10 09:47:31 EST 2003 | davef

James: So, why don't you clean your no-clean? At least then you stand a chance of doing class 2 and class 3 work.

Voids in solder fillet

Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef

60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%

Part clearances in PCB design

Electronics Forum | Mon May 03 21:39:09 EDT 2004 | ACE

Does anyone know there a standard matrix of clearances part to part for Class 2 and Class 3 board design. IPC does issue a preferred matrix but they are so liberal they not so useful in the real world. Any suggestions would really be appreciated.

Class III PCB Manufacturer Needed

Electronics Forum | Wed Oct 13 19:16:42 EDT 2004 | secme

Go to http://www.h-st.com Houston Sigma has been doing almost exclusively Class 3 for years

Soldering Specification Needed

Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101

The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO


class 3 searches for Companies, Equipment, Machines, Suppliers & Information