Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Thu May 31 12:21:14 EDT 2007 | patrickbruneel
Let me give you some good advice You take already plenty of risk going lead-free, DO NOT use halogen containing fluxes in a lead-free no-clean process. Halogens left on the board will convert tin, silver and exposed copper into metal salts over tim
Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Fri May 17 15:50:17 EDT 2002 | davef
Now that�s a switch. Most are moving or properly have moved in the polar opposite direction. Dano, has someone been drilling your teeth lately? We use water washable flux to: * Remove solder balls. [Or put another way, we don�t have to screw-down
Electronics Forum | Fri Apr 30 03:49:25 EDT 1999 | Charles Stringer
| | | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | | | We are considering trying boards with Whit
