Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Thu Feb 26 14:47:19 EST 2015 | superlen
unique mnf/mnf part number. - Be meticulous on maintaining your WO Boms. Train your employees to not circumnavigate keeping the WOBOM accurate to what they kitted/placed on the board. If you keep the one to one part number relationship above this is
Electronics Forum | Fri Aug 28 12:05:12 EDT 2015 | davef
“The global automotive industry demands world class levels of product quality, productivity and competitiveness as well as continual improvement. To achieve this goal many vehicle manufacturers insist that suppliers are certified to the quality manag
Electronics Forum | Tue Sep 20 15:00:26 EDT 2016 | awhite
Got it!!!!! On the main Operator Screen for the MPM UP2000, and under configuration (when logged-in under maintenance), it gives you ONLY the settings that the machine is set to....there are no drop-downs or options available to choose from. Very fr
Electronics Forum | Thu Jun 15 18:15:34 EDT 2006 | nickel
If you have time, download the free Practical Guide to Understanding the Scope of the WEEE and RoHS, you will find what they say about UPS. They consider UPS out from the field of application of RoHS. ORGALIME (Bruxelles)is the European Engineering
Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice
> We unfortunately use GERBER data to digitize <BR> > boards more than any CAD. We are CM and many of <BR> > our customers do not provide CAD. With some <BR> > Legacy products, we still use 274-D Gerbers
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Mon Apr 09 11:39:32 EDT 2018 | emeto
The easiest way to do without special tools is to use level. Check machine co-planarity on the conveyor rails in both directions(you can do that with rails down or rails up or both). Then check co-planarity on the stencil. If the level shows the sam
Electronics Forum | Mon Apr 09 22:40:38 EDT 2018 | jacobidiego
What kind of level have micrometer precition?
