Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Sun Sep 28 16:06:21 EDT 2003 | Keith Petersen
I am a QA engineer in a telecommunications company. I am searching for both electrical and mechanical reliability standards that govern chip on board tests. Are there similar standards to IPC or JEDEC for COB in rugged commercial applications? I a
Electronics Forum | Thu Jan 20 09:30:09 EST 2005 | russ
That's what I thought it was. We may very well contract this out. We don't have underfill capability and the volumes may not warrant us investing. Do you know of someone doing this? I don't know at this time if it is the flip chip or the wire
Electronics Forum | Tue Feb 08 11:14:45 EST 2005 | George
Have a customer that needs to find someone that can do Chip on board Wire bonding automated only. You folks know of anyone? We are in the Newengland Area. You know, where the Patriots reside?
Electronics Forum | Sat Jul 16 07:46:17 EDT 2005 | davef
If you have a glob of epoxy on your board, it will be difficult to stencil you paste on that side. Dispensing paste may be a better choice.
Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit
If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.
Electronics Forum | Thu Mar 20 08:45:02 EDT 2008 | davef
Common methods use to protect pads from solder splatter are: * No residue Kapton tape * Nonionic solder mask
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz
hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.
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