Electronics Forum | Tue Nov 01 12:28:36 EDT 2016 | comatose
It depends. Are you hand breaking them, rotary knife or linear knife? Hand break you want to be about 5mm (and it isn't a great practice even then) with a rotart knife you want to keep parts probably 3mm, especially capacitors. With a linear knife we
Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason
Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to
Electronics Forum | Wed Jun 10 19:53:01 EDT 1998 | Joe Herz
| The Tesa company delivers Splice Tape for 8mm, | 12mm and 16mm. Also special splice tape for 8mm | paper tape and some splice tools as well. | Siemens uses for large tape a 'staple' but might | be patented and then cannot be used outside Siemens.
Electronics Forum | Wed Jul 01 10:32:01 EDT 1998 | Eric Klaver
| How can I reach Tesa? I've tried to find a website that contains some useful information but no luck. | By the way, Siemens has stonewalled me regarding their tool/material. Seems to be reserved for Siemens | users exclusively. Joe, The address
Electronics Forum | Thu Jun 04 11:13:39 EDT 1998 | Justin Medernach
| Looking for vendors of splicing tape for 8,12 and 16mm tape and reel. | Any net sources? Mike, Give Siemens a call. They have a decent little system. It's comprised of thin metal fasteners that hold the carrier tape together via the holes, a crim
Electronics Forum | Wed Jun 10 22:19:31 EDT 1998 | Dave F
| | The Tesa company delivers Splice Tape for 8mm, | | 12mm and 16mm. Also special splice tape for 8mm | | paper tape and some splice tools as well. | | Siemens uses for large tape a 'staple' but might | | be patented and then cannot be used outsid
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
