Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Wed Sep 23 08:17:46 EDT 2009 | kpm135
I've run into mysterious light curtain errors before and what was happening was when the head moved across the top of the components one of the clear tape covers would flutter up and trigger the curtain then it would settle back down on top of the ta
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
Electronics Forum | Mon Jul 13 13:48:37 EDT 2009 | christian01976
Hello! You can check your vacuum in MANUAL and then VACUUM IN MONITOR. You can switch the vacuum on or off for each head. With a TYPE 72 nozzle and no component the vacuum should be around 80 or 90 and with a component at the nozzle it should be ove
Electronics Forum | Fri Nov 14 07:32:24 EST 2008 | davef
Yes, courtyard gives you the space requirement of a component. Sometimes, the working space of a rework tool takes precidence, though.
Electronics Forum | Mon Apr 04 11:46:20 EDT 2011 | frcdave
I was thinking the same thing. Try turning off your anchors and look at the size of your search and % match you have set. if you are concerned about not catching missing components, try training a negative template.
