Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
Electronics Forum | Fri Dec 07 15:17:06 EST 2001 | davef
Dull / shiny, I�m not sure that�s a proper indicator. If �Liquid Tin� adds a thin coat of solderable material without converting the corrosion on the surface of the lead, the corrosion will [probably] continue to increase and potentially affecting t
Electronics Forum | Thu Dec 03 13:24:12 EST 1998 | Russ M
| | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | |
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting
hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,
Electronics Forum | Wed Aug 01 17:17:15 EDT 2001 | mparker
Since you are restricting the outward flow of injected material to basically mimic the package dimensions that would force you to design some sort of coffer dam beneath the part to contain the injected material. One alternative to your quest could b
Electronics Forum | Mon Aug 06 16:08:57 EDT 2001 | seand
Hello Again John, Are you injecting a like material currently? How are you doing this with your current process? Is this material being used specifically because the customer identified it as such? If this is not a current process for you, how do
Electronics Forum | Thu Mar 25 13:31:42 EST 2004 | Ren�
Hi Daniele: In a design of experiments with four methods for attaching thermocouples : High Temperature Solder, Aluminum Tape (Chomerics T405), Kapton Tape and Conductive Epoxy (Loctite Tak Pak 382. The most reliable method is high temperature solde
Electronics Forum | Sat May 08 13:56:27 EDT 2004 | Ken
If this is a requrement from your customer then: They should supply the name/brand of the material, AND they must supply solder samples because their requiremnt is a destructive profiling technique. You should charge them more dollars for setup and
