Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
Electronics Forum | Thu Oct 12 12:22:52 EDT 2000 | stefano bolleri
This is a question about LCDs (Liquid Crystal Displays) packaged as SIPs or DIPs. My question is: can they be wave-soldered? I found process recommendations on Web pages of several LCD suppliers, and they pretty much all say that LCDs should NEVER be
Electronics Forum | Thu Aug 19 10:36:53 EDT 1999 | John O'Brien
| CAN ANYBODY ADVISE ME AS TO INDIVIDUAL PCB IDENTIFICATION THROUGH ASSEMBLY - THE PROS AND CONS | | THANKS | Leo: I have been doing a bit of research on this topic recently. I would be glad to discuss it with you. It seems the best technology is
Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael
A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc
Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Wed Mar 17 19:58:00 EST 1999 | Marc Ruggiero
Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and sometimes f
Electronics Forum | Mon Mar 15 15:52:38 EST 1999 | Earl Moon
| After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voi
Electronics Forum | Fri Feb 05 12:52:22 EST 1999 | Jason Hall
| Anyone heard of a BGA599. I was wondering the package size of this part, and if a GSM-1 would have any problems placing it. | | Jamie Ford | I am not sure of the package size of this part but I do not see why a GSM-1 would have any problems pla
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell
I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit
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