Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Thu Jul 11 06:56:30 EDT 2002 | davef
We have had failure due to a leakage in one ceramic chip capacitor. External inspection did not show any obvious damage. Cross section showed a void in the capacitor. The void was an elliptical shape and positioned longitudinal to the length of the c
Electronics Forum | Tue Apr 29 11:19:09 EDT 2003 | davef
Metallization failure. A defect such as voids, cracks, separations, depressions, notches or tunnels or any combination in the cross sectional reduction that is a basis for rejection.
Electronics Forum | Mon Jul 07 23:17:34 EDT 2003 | MA/NY DDave
Hi After reading the dialog I think you should send this to a lab that can do cross sections a little etching and raise the magnification. YiEngr, MA/NY DDave
Electronics Forum | Fri Apr 30 12:14:03 EDT 2004 | Bryan She
In addition,the transistor is SOT23 packeage.it seems that after the reflow excursion,this parts was damaged.but...why this damage only happens on the same location on board?Maybe,i'd like to do a cross-section of the damaged parts. it looks strange.
Electronics Forum | Sat Jul 02 06:19:01 EDT 2005 | Dhanish
My customer feedback they found one board with cold solder on the BGA ball.I looked at the picture,the ball looks very shining but I dont think that is a cold solder.What is the method can be used to confirm the colde solder beside cross sectioning t
Electronics Forum | Wed Jan 04 02:54:25 EST 2006 | Slaine
Hi, Id like to see the photos if possible, you can tell a lot from cross sections and the shape of the crack if you have any. timlivesey@netscape.net
Electronics Forum | Mon Jan 09 13:41:09 EST 2006 | slthomas
Take a look at the boards, too. Could the HASL be different (in particular a domed or convex cross section) than what you're used to seeing? Is your printer actually working properly?
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
