Electronics Forum | Sun Nov 22 19:59:26 EST 2009 | prodivegsr
Hi Davef, The bubbles occurs at the body also...there's also a washing process before the conformal coating:-the Flux residue are removed after washing. ... The curing profile is also something that we are looking into during the initial troubles
Electronics Forum | Sun Nov 29 20:04:05 EST 2009 | prodivegsr
Hi sforman1, The chemical that i'm using is a solvent based coating humiseal 1B73. From my understanding,the UV curing is mainly for UV curable coating like the UV40. And the main advantage of using UV curing is for fast throughput and environment
Electronics Forum | Thu Mar 08 10:26:52 EST 2007 | pfifla1
I am looking for the software for the select cure ir curing oven nordson made, if anyone has it please let me know i would like to buy a copy.
Electronics Forum | Thu May 28 03:18:22 EDT 2009 | cunningham
We use an epoxy method at the moment but the cure times are long with 4 hours oven cure and 4 hours air cure before solder can be applied to the pad the hot press bonds the already made epoxy pad to the board in less than 5 min and is ready to solde
Electronics Forum | Mon Sep 28 12:25:13 EDT 2009 | vleasher
Could someone point me in the direction of some good manufactures of batch style curing ovens? We have a new project requiring Humiseal 2A64 and we do not have an oven for the 3hrs @ 170F cure. Thanks in advance!
Electronics Forum | Thu Nov 19 22:48:22 EST 2009 | davef
Since the bubbles: * Are only on the solder connection, we'd guess there must be some compatibility issue between the flux residues and the conformal coat materials. * Occur after curing, we'd guess the cure recipe is too rapid and is entrapping voli
Electronics Forum | Wed Nov 25 15:16:04 EST 2009 | sforman1
Why in heavens name are you using a heat or air cure conformal coating. Why aren't you using a 100% solids UV cure system. You would never have an issue like this Sam Forman MicroCoat Technologies
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
Electronics Forum | Wed Nov 16 14:57:57 EST 2011 | austinpeterman
Hello Don, We dont heat cure any of our assemblies. We coat relitively few boards and just let them cure at room temp. Perhaps we should start heat curing. In fact, we have an old, fully functional, heller 1500 just sitting in storage. Hmmm. . .
Electronics Forum | Thu Jan 30 17:29:30 EST 2020 | stephendo
Even if it is no where near the pumps it is probably certified explosion proof. Could they have had aluminum sheets, painted them, cured them, stenciled conductive traces, cured it, stenciled conductive adhesive, populated parts, cured it then singu
