Electronics Forum: dendrite vs ionic (Page 5 of 6)

Rosin vs. Resin Flux

Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala

Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or

Contamination test

Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef

You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee

Re: Criteria for the Omega Mete from Alpha Metals Inc.

Electronics Forum | Mon Jan 08 20:57:52 EST 2001 | Dave F

Are you talking about bare board cleanliness or assembly level cleanliness? Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acce

Re: RF applications..aqueos vs. no clean..HELP!!!!

Electronics Forum | Thu Mar 25 19:29:07 EST 1999 | Graham Naisbitt

| | Hi, | | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | | Is aqueous cleaning necessary to eliminate 'cross ta

Re: RF applications..aqueos vs. no clean..HELP!!!!

Electronics Forum | Mon Mar 29 19:31:29 EST 1999 | Scott McKee

| | | Hi, | | | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | | | Is aqueous cleaning necessary to eliminate 'cr

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Re: Water Soluble Flux for Military

Electronics Forum | Tue Apr 14 15:42:45 EDT 1998 | Scott Cook

| Scott, | I am not really in a position to answer this as fully as I would like because most military work with which I am familiar is subject to some degree of secrecy most especially on the internet. At least we have signed up to such restrictions

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW

| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu

Incoming Water Quality

Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef

The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound


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