Electronics Forum | Mon Aug 15 10:32:43 EDT 2005 | Woodsmt
Does any one know of a Lab which performs mechnical flex testing of boards? I have a problem with ceramic devices cracking, and need to determine how much flex is ocurring to help in stiffiner designs. It would be helpful if the Lab is in the New Eng
Electronics Forum | Wed Sep 05 10:13:21 EDT 2007 | slthomas
When I worked for a med. device company it was always great fun to observe the UL testing. Everyone would gather around the stairwell and say bon voyage to an $8k piece of gear. This was NOT a test of the mechanical strength of soldered connections
Electronics Forum | Tue Nov 14 05:02:39 EST 2000 | Wolfgang Busko
Hi George, you got to find the common factor for the parts that are misaligned. This double sided tape method is IMO a good one for the first shot but you have some waste in parts that should be considered. (Better skip those precious parts for the
Electronics Forum | Mon Nov 30 17:41:54 EST 2015 | palsingh
Shonen, We manufacture PCB's at Macrotron, Inc in Fremont, California. Feel free to call us at 510-683-9600 to discuss cost and options. We are very affordable and test each device to ensure consistent quality. Kim Macrotron Systems 44235 Nobe
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Tue Nov 25 11:58:31 EST 2008 | rway
Hello all, We are using z1850/60 machines. The APC test is damaging a 1.8V device on the board. The APC stimulates -/+3Vdc in fast mode. I understand the dangers of over-voltage. But what I need to know is how the part is being damaged when the ent
Electronics Forum | Wed Sep 01 05:09:27 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, I am wondering if the device could have so much moisture in it and storing it in a dry cabinet isn't going to remove it all. As a final test to see if moisture in the device is causing the voids/solder balls then I'd bake it a
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Wed Aug 12 07:18:29 EDT 1998 | Earl Moon
| Looking for Suppliers of surface mount wetting balance equipment. I've used Kester's equipment. It conforms to, and performs in accordance with requirements Dave stated. It's expensive stuff ($32K last time I bought one). For this reason, you migh
