Electronics Forum | Wed Sep 29 14:22:58 EDT 2021 | ttheis
Thanks for the tip!
Electronics Forum | Fri Feb 13 12:16:05 EST 2004 | Mike Konrad
Ashok, It is most likely not the DI water that is attacking the aluminum rather it is the saponifier. DI water is only in contact with the parts for a relatively short time. If your cleaning process provides for a rapid drying cycle, you should be
Electronics Forum | jimdugan |
Mon Feb 14 10:34:08 EST 2005
Electronics Forum | Thu Feb 24 10:00:43 EST 2005 | GS
Did you considered Aquastorm 200 (speedline)? Regards GS
Electronics Forum | Mon Nov 14 10:46:48 EST 2011 | dyoungquist
Have you tried an ultrasonic water cleaning process? We use an ultrasonic cleaner with tap water and Omega Aqua Clean LPH cleaner (omegasonics.com) then rinse with DI water. However, our cleaning requirements are not as strict as yours are from the
Electronics Forum | Tue Jul 31 13:55:27 EDT 2001 | mparker
Maintain DI water to 18 Meg Ohms resistivity. You can go down as low as 2 Meg ohms, in a pinch, but I would caution on what type of board you are running if trying to clean on 2 Meg ohm. Anything that is running an RF or high frequency circuit could
Electronics Forum | Fri Nov 11 01:48:05 EST 2011 | julien
Thanks guys, But for the cleaning process we already have a chemical product to clean flux residues and other contaminant. But it seems that we can't rinse properly under low stand-off components and we find trace of our chemical under some ceramic c
Electronics Forum | Mon Jul 18 00:00:35 EDT 2005 | adlsmt
I have nothing to add technically but we have been washing no-clean for years. Use very clean filtered DI water to avoid the white residue issue and some good detergent or sopanifier and you will get great results.
Electronics Forum | Wed Sep 29 11:15:46 EDT 2021 | dontfeedphils
I would recommend some sort of saponifier that has been tested and is known to remove the no clean flux residues that you're trying to remove.
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
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