Electronics Forum | Fri Jan 30 18:24:09 EST 2009 | gsala
Buenas dias Jos�, It shoul not be a problem. We had situation like that when in the early 2006 the Lead Free fase in Pb fase out, no pbm on solder joints. Today, after about 3 years, those cards are stil working in the field without any defect. Reg
Electronics Forum | Wed Sep 01 08:16:55 EDT 2010 | sachu_70
Drill holes or tooling holes have higher tolerances than Fiducial marks during PCB fabrication. I would certainly recommend Fiducial recognition as a more reliable approach for better accuracy. You could re-calibrate the Vision system file used for
Electronics Forum | Fri Sep 03 03:49:24 EDT 2010 | sachu_70
In case of pure pattern recognition, i agree with your view. However, the basic functionality of the fiducial is determine any positional offset of the PCB and provide necessary data for correction during the intended operation such as Paste printing
Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley
Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Fri Jun 30 10:42:24 EDT 2000 | Chrys Shea
That pad had a 16 mil dia, so I arrived at 20 mil squares by adding 2 mils to each side of the pad. Following that logic, a 12 mil pad would use a 16 mil square. But a 12 mil pad is on a finer pitch that isn't mentioned, so you should definitely
Electronics Forum | Thu Mar 18 10:09:57 EST 1999 | Stefan Witte
| My engineering Dept. has informed me that they want | to start using pins, on an aluminum substrate in the | smt process. Pins are interconnect for daughter bds. | Dia. of pins 0.020" 0.040" 0.080" flat bottoms | 1) Does any one know how to
Electronics Forum | Wed Dec 16 19:37:19 EST 1998 | Ron Costa
I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 14
Electronics Forum | Sat Jul 25 04:48:40 EDT 1998 | Stoney Tsai
Hi, good friends I found this site is so wonderful to learn SMT techniques meaningfully. We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the cabinet
