Electronics Forum | Wed Nov 11 06:59:20 EST 1998 | Jim Mitchell
Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in 19
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Wed Dec 10 18:47:28 EST 2003 | Rob Sierra
Hi James, Mag-D Electronics in Los Angeles ALSO carries ALL Tape Splicer tools and tapes. You can reach Mag-D Electronics at 818-762-0058 or http://www.magdelectronics.com. We also carry Adhesive Back Die Carrier Tapes and Feeders.
Electronics Forum | Wed Mar 09 04:21:16 EST 2005 | Rob
We have a couple of presses we use for cutting adhesive backers & depanelising flex's etc. You can usually get away with steel rule dies which cost a couple of hundred dollars instead of hard tooling.
Electronics Forum | Sat Apr 23 11:37:12 EDT 2005 | Dhanish
What are the reasons for the Heatsink falling off from the boards?The attachment method is using Adhesive Tape.
Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Wed Mar 15 11:51:35 EDT 2017 | cyber_wolf
Rob, I believe that is for die attach voiding not solder interface.
Electronics Forum | Wed May 07 09:02:29 EDT 2003 | cyber_wolf
I was wondering if anyone has done a study on thermo couple attachment with light cure adhesive.I have read all the papers and articles about aluminum tape, Kapton, and high temp solder.I have yet to hear anything regarding the accuracy of light cure
