Electronics Forum | Mon Mar 13 04:49:59 EST 2006 | Fhail
Hi All, I'm new in PCBA process. Recently in my leadfree production we encountered a missing ring on some of the ring on the board after we ran hem through Wave soldering machine. The board has gone through double reflow prior to the Wave soldering.
Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Wed May 03 20:19:31 EDT 2000 | Dave F
Sal: Sorry, sometimes (more often than I�d like to admit) I�m a bit dense. But first � Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and is applied inaccurately to metallurgical effects, like diff
Electronics Forum | Mon Dec 06 09:16:22 EST 1999 | Dave F
Russ: Three things: 1 Wolfgang is 100% correctamundo about the slow dissolution rate of gold 2 Shear stength of the gold 63/37 solder connection decreases rapidly, as the gold content of the solder connection increases above 2%. 3 There are many
Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F
| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Fri Apr 25 17:03:34 EDT 2003 | davef
Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and, at times, is applied inaccurately to metallurgical effects, like diffusion, that occur after the solder has solidified. Please help us understand y
Electronics Forum | Fri Jun 16 10:23:40 EDT 2006 | pms
Thanks Davef, We recommend ENIG to our customers at this time, we have not had any customers reporting issues with it so far. I like the protection of the nickle from copper dissolution during wave in a PB free scenerio, but the "Black-Pad" issue i
Electronics Forum | Mon Dec 04 13:02:57 EST 2006 | patrickbruneel
Life after RoHS is a nightmare Delamination is the No. 1 issue in mixed technology. No. 2 is voids due to the inferior wetting characteristics of lead-free alloys compared to leaded alloys. No. 3 is copper dissolution. The full effect of RoHS will
Electronics Forum | Thu Dec 20 16:32:54 EST 2007 | gsala
Over here in Eurolandia the following Allois are running like a piece of cake. http://www.krepro.no/tinn_pasta_fluss/NiGe-Stangtinn.pdf It is FUJI patent Formula, sold in Eurolandia by FELDER Germany Really a good help in the Lead Free Wave Solder
