Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon
ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that
Electronics Forum | Mon Oct 24 16:24:53 EDT 2011 | smdbert
Hello, My name is Bert i'm working by LéTÉ with two mydata smd machines and have sometimes several problems ,most of the problems try to solve it by myself but sometimes the boss also helps and i write the errors in map but first of all 4 questions
Electronics Forum | Thu Oct 11 13:37:35 EDT 2001 | Stefan
The pressure sensitive tape is used as an alternative to heat sealed cover tape. It works usually quite well and is easily applied by the taping machine, but it can create some problems in the tape feeder. In the Surftape, Cal is referring to, the c
Electronics Forum | Tue Jun 05 14:38:55 EDT 2001 | pteerink
You would be better served to check your print quality as you run. Any problems caused by dirty stencils ( plugged aps etc ) would show up right away as a defect. Search the forum for more on this subject. I seem to recall the same subject coming up
Electronics Forum | Mon Jan 31 12:15:32 EST 2000 | Neil
I am looking for a Mydata users group, one possibly located in the Chicago area. If such a group does not exist, I would be more than happy to help start one. I have an older Mydata TP9 (non-UNIX) machine, with weak (yet expensive) support from the m
Electronics Forum | Thu Oct 14 18:17:34 EDT 1999 | JAX
Larry, What's happening. You can get this information from the manufacturer. All you need is the manufacturing part number. You should be able to get this from the purchasing department. Once you have this info just open up their website and fo
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Sat Jan 25 17:46:07 EST 2003 | testing
I am currently finding it challenging(help!) to determine how I can introduce SPC ontrol within the AOI process and how the AOI can help control other SMT processes. Can someone please provide me with some ideas or any of excels fancy charts/macro
